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HS Code 84 Nuclear reactors, boilers, machinery and mechanical appliances; parts thereof

The HS Code 84 is described as
Nuclear reactors, boilers, machinery and mechanical appliances; parts thereof

Description
Section XVI

Machinery and Mechanical Appliances; Electrical Equipment; Parts
Thereof; Sound Recorders and Reproducers, Television Image and
Sound Recorders and Reproducers, and Parts and Accessories of Such
Articles

Section Notes

1. This section does not cover:

(a). Transmission, conveyor or elevator belts or belting, of
plastics of chapter 39, or of vulcanized rubber (heading
4010); or other articles of a kind used in machinery or
mechanical or electrical appliances or for other technical
uses, of vulcanized rubber other than hard rubber (heading
4016);

(b). Articles of leather or of composition leather (heading 4204)
or of furskin (heading 4303), of a kind used in machinery or
mechanical appliances or for other technical uses;

(c). Bobbins, spools, cops, cones, cores, reels or similar
supports, of any material (for example, chapter 39, 40, 44
or 48 or section XV);

(d). Perforated cards for Jacquard or similar machines (for
example, chapter 39 or 48 or section XV);

(e). Transmission or conveyor belts or belting of textile
material (heading 5910) or other articles of textile
material for technical uses (heading 5911);

(f). Precious or semiprecious stones (natural, synthetic or
reconstructed) of headings 7102 to 7104, or articles wholly
of such stones of heading 7116, except unmounted worked
sapphires and diamonds for styli (heading 8522);

(g). Parts of general use, as defined in note 2 to section XV, of
base metal (section XV), or similar goods of plastics
(chapter 39);

(h). Drill pipe (heading 7304);

(i). Endless belts of metal wire or strip (section XV);

(j). See (i) above.

(k). Articles of chapter 82 or 83;

(l). Articles of section XVII;

(m). Articles of chapter 90;

(n). Clocks, watches and other articles of chapter 91;

(o). Interchangeable tools of heading 8207 or brushes of a kind
used as parts of machines (heading 9603); similar inter-
changeable tools are to be classified according to the
constituent material of their working part (for example, in
chapter 40, 42, 43, 45 or 59 or heading 6804 or 6909);

(p). Articles of chapter 95 or

(q). Typewriter or similar ribbons, whether or not on spools or
in cartridges (classified according to their constituent
material, or in heading 9612 if inked or otherwise prepared
for giving impression).

2. Subject to note 1 to this section, note 1 to chapter 84 and to
note 1 to chapter 85, parts of machines (not being parts of the
articles of heading 8484, 8544, 8545, 8546 or 8547) are to be
classified according to the following rules:

(a). Parts which are goods included in any of the headings of
chapter 84 or 85 (other than headings 8409, 8431, 8448,
8466, 8473, 8485, 8503, 8522, 8529, 8538 and 8548 are in
all cases to be classified in their respective headings);

(b). Other parts, if suitable for use solely or principally
with a particular kind of machine, or with a number of
machines of the same heading (including a machine of
heading 8479 or 8543) are to be classified with the
machines of that kind or in headings 8409, 8431, 8448,
8466, 8473, 8503, 8522, 8529 or 8538 as appropriate.
However, parts which are equally suitable for use
principally with the goods of headings 8517 and 8525 to
8528 are to be classified in heading 8517;

(c). All other parts are to be classified in headings 8409,
8431, 8448, 8466, 8473, 8503, 8522, 8529, or 8538 as
appropriate or, failing that in heading 8485 or 8548.

3. Unless the context otherwise requires, composite machines
consisting of two or more machines fitted together to form a
whole and other machines designed for the purpose of performing
two or more complementary or alternative functions are to be
classified as if consisting only of that component or as being
that machine which performs the principal function.

4. Where a machine (including a combination of machines) consists
of individual components (whether separate or interconnected by
piping, by transmission devices, by electric cables or by other
devices) intended to contribute together to a clearly defined
function covered by one of the headings in chapter 84 or
chapter 85, then the whole falls to be classified in the
heading appropriate to that function.

5. For the purposes of these notes, the expression "machine" means
any machine, machinery, plant, equipment, apparatus or
appliance cited in the headings of chapter 84 or 85.

Statistical Note

1. Provisions for semiconductor manufacturing and testing machines
and apparatus cover products for the growth and processing of
semiconductor materials, such as silicon and gallium arsenide,
the processing of such materials into semiconductor devices and
the testing of such devices (in general the testing equipment,
as well as some of the processing equipment, is classified in
chapter 90). More specifically the goods include the following:

(a). Wafer manufacturing equipment:

(i). Crystal growers & pullers - used to produce extremely
pure monocrystalline semiconductor boules from which
wafers can be sliced. Most common methods employed in
these crystal growers and pullers are the Czochralski
and float zone methods.

(ii). Wafer preparation equipment:

(A). Crystal grinders - used to grind the crystal
boule to precise diameter required for wafers and
to grind the flats on the boule to indicate the
conductivity type and resistivity of the crystal.

(B). Wafer slicing saws - used to slice wafers from a
boule of monocrystalline semiconductor material.

(C). Wafer grinders, lappers and polishers - used to
prepare the semiconductor wafer for the fab-
rication process. This involves bringing the
wafer within dimensional tolerances. Especially
critical is the flatness of its surface.

(b). Mask fabrication and repair equipment:

(i). Fabrication equipment - used to transfer design
patterns to a mask of reticle, this equipment
generally utilizes optical, electron beam or X-rays
to write circuit patterns on photoresist coated
substrates. After development, these substrates
become the mask or reticle for wafer fabrication.

(ii). Repair equipment - this equipment generally utilizes
focused ion beams or laser beams. They are used
directly on the mask or reticle to remove chrome.

(c). Wafer fabrication equipment:

(i). Film formation equipment - used to apply or produce
various films on the surface of the wafer during the
fabrication process. These films serve as conductors,
insulators and semiconductors on the finished device.
They may include oxides and nitrides of the substrate
surface, metals, and epitaxial layers. The processes
and equipments listed below are not necessarily
limited to the generation of a particular type of
film.

(A). Oxidation furnaces - used to form a "film" of
oxide on the wafer. The oxide is formed by the
chemical reaction of the top molecular layers
of the wafer with the applied oxygen or steam
under heat.

(B). Chemical Vapor Deposition (CVD) equipment - used
to deposit various types of films which are
obtained by combing the appropriate gases in a
reactant chamber at elevated temperatures. This
constitutes a thermochemical vapor-phase
reaction. Operations may take place at
atmospheric or low pressure (LPCVD) and may use
a plasma enhancement (PECVD).

(C). Physical Vapor Deposition (PVD) equipment - used
to deposit various types of films which are
obtained by vaporizing a solid.

(1). Evaporation equipment - in which the film is
generated by heating the source material.

(2). Sputtering equipment - in which the film is
generated by bombarding the source material
(target) with ions.

(D). Molecular Beam Epitaxy (MBE) equipment - used to
grow epitaxial layers on a heated mono-
crystalline substrate in an ultrahigh vacuum
using beams of molecules. The process is
similar to "PVD."

(ii). Doping equipment - which is used to introduce dopants
into the wafer surface in order to modify the
conductivity or other characteristics of a semi-
conductor layer:

(A). Thermal diffusion equipment - in which the
dopants introduced into the surface of the wafer
by the application of gases under high
temperatures.

(B). Ion Implantation - in which the dopants are
"driven" into the crystal lattice structure of
the surface of the wafer in the form of a beam
of accelerated ions.

(C). Annealing furnaces - which are used to repair
the crystal lattice structures of the wafer
damaged by ion implantation.

(iii). Etching and stripping equipment - used for etching or
cleaning surfaces of the wafers.

(A). Wet etching equipment - in which chemical etching
materials are applied by spraying or immersion.
Spray etchers provide more uniform results than
bath etchers, since they perform the operation
on one wafer at a time.

(B). Dry plasma etching - in which etching materials
are presented as gases within a plasma energy
field, providing and anisotropic etch profile.

(C). Ion beam milling equipment - in which ionized gas
atoms are accelerated toward the wafer surface.
The impact results in the top layer being
physically removed from the surface.

(D). Strippers or ashers - using techniques similar to
etching, this apparatus removes the spent
photoresist from the surface of the wafer after
it has served its purpose as a "stencil". This
equipment is also used for removal of nitrides,
oxides, and polysilicon, with an isotropic etch
profile.

(iv). Lithography equipment - used to transfer the circuit
designs to the photoresist coated surface of the
semiconductor wafer.

(A). Equipment for coating wafers with photoresist -
these include the photoresist spinners which are
used to apply liquid photoresist evenly over the
surface of the wafer.

(B). Equipment for exposing the photoresist coated
wafer with the circuit design (or a part thereof):

(1). Using a mask or reticle and exposing the
photoresist to light (generally ultraviolet)
or, in some instances, X-rays:

(a). Contact printers - where the mask or
reticle is in contact with the wafer
during exposure.

(b). Proximity aligners - similar to contact
aligners except actual contact doesn't
take place between the mask or reticle
and the wafer.

(c). Scanning aligners - which use projection
techniques to expose a continuously
moving slit across the mask and wafer.

(d). Step and repeat aligners - which use
projection techniques to expose the
wafer a portion at a time. Exposure can
be by reduction from the mask to the
wafer or 1:1. Enhancements include the
use of an excimer laser.

(2). Direct write on wafer equipment - these
apparatus operate with no mask or reticle.
They use a computer controlled "writing beam"
(such as, an electron beam (E-beam), ion beam
or laser) to "draw" the circuit design
directly on the photoresist coated wafer.

(C). Equipment for developing exposed wafers - these
include chemical baths similar to those used in
photographic laboratory applications.

(d). Assembly equipment:

(i). Dicing equipment - these include sawing machines and
scribing machines (including laser scribers) and
dicing accessories such as water breaking equipment.

(ii). Die bonding equipment - which installs the die to the
package by soldering or gluing.

(iii). Wire bonding equipment - used for attaching thin
wires or tapes (usually of gold, aluminum or copper)
from the die bonding pads to the corresponding pads
on the package.

(iv). Packaging equipment - which are used to encapsulate or
package a semiconductor device. They include sealing
furnaces, lid welders, plastic encapsulation presses,
lead trim and form equipment, package deflashers, and
tin dip and solder plate equipment.

(e). Testing and inspection equipment:

(i). Optical inspection equipment - these include equipment
that "examines" portions of the wafer surface and
compares them either to a standard pattern or to other
portions of the wafer surface.

(ii). Electrical testing equipment - these include computer
controlled systems that test the functions and
electrical specifications of semiconductor devices
through the application and detection of electrical
signals or patterns. Testing is performed on both
unencapsulated dice and packaged integrated circuits.
(2019-08-02)

It belongs to the code group
HS code

To this Code "84" belongs the sub codes
  • HS Code 8401: Nuclear Reactors; Fuel Elements (Car Tridges), Non-Irradiated, For Nuclear Reactors; Machinery And A
  • HS Code 8402: Steam Or Other Vapour Generating Boilers ( Other Than Central Heating Hot Water Boliers Capable Also
  • HS Code 8403: Central Heating Boilers Other Than Those Of Heading N? 8402
  • HS Code 8404: Auxiliary Plan For Use With Boliers Of Heading N? 8402 Or 8403 ( For Example, Economisers, Super-Hea
  • HS Code 8405: Producer Gas Or Water Gas Generators, With Or Without Their Purifiers; Acetylene Gas Generators And
  • HS Code 8406: Steam Turbines And Other Vapour Turbines
  • HS Code 8407: Spark-Ignition Reciprocating Or Rotary Internal Combustion Piston Engines
  • HS Code 8408: Compression-Ignittion Internal Combustion Piston Engines (Diesel Or Semi-Diesel Engines)
  • HS Code 8409: Parts Suitable For Use Solely Or Principally With The Enginers Of Heading N? 8407 Or 8408
  • HS Code 8410: Hydraulic Turbines, Water Wheels, And Regulators Therefor
  • HS Code 8411: Turbo-Jets, Turbo-Propellers And Other Gas Turbines
  • HS Code 8412: Other Engines And Motors
  • HS Code 8413: Pumps For Liquids, Whether Or Not Fitted With A Measuring Device; Liquid Elevators
  • HS Code 8414: Air Or Vacuum Pumps, Air Or Other Gas Compressors And Fans; Ventilating Or Recycling Hoods Incorpora
  • HS Code 8415: Air Conditioning Machines, Comprising A Motor-Driven Fan And Elements For Changing The Temperature A
  • HS Code 8416: Furnace Burners For Liquid Fuel, For Pulverised Solid Fuel Or For Gas; Mechanical Stokers, Mechanica
  • HS Code 8417: Industrial Or Laboratory Furnaces And Ovens, Including Incinerators, Non-Electric
  • HS Code 8418: Refrigerators, Freezers And Other Refrigerating Or Freezing Equipment, Electric Or Other; Heat Pumps
  • HS Code 8419: Machinery,Plant Or Laboratory Equipment, Whether Or Not Electrically Heated, For The Treatment Of Ma
  • HS Code 8420: Calendering Or Other Rolling Machines Other Than For Metals Or Glass, And Cylinders Thereof
  • HS Code 8421: Centrifuges, Including Centrifugal Dryers; Filtering Or Purifying Machinery And Apparatus, For Liqu
  • HS Code 8422: Dish Washing Machines; Machinery For Cleaning Or Drying Bottles Or Other Containers; Machinery For F
  • HS Code 8423: Weighing Machinery ( Excluding Balances Of A Sensitivity Of 5 Cg Or Better), Including Weight Operat
  • HS Code 8424: Mechanical Appliances ( Whether Or Not Hand-Operated) For Projecting, Dispersing Or Spraying Liquids
  • HS Code 8425: Pulley Tackle And Hoists Other Than Skip Hoist; Winches And Capstans; Jacks
  • HS Code 8426: Derricks; Cranes, Including Cable Cranes; Mobile Lifting Frames, Straddle Carriers And Works Trucks
  • HS Code 8427: Fork-Lift Trucks; Other Works Trucks Fitted With Lifting Or Handling Equipment
  • HS Code 8428: Other Lifting, Handling, Loading Or Unloading Machinery ( For Example, Lifts, Escalators, Conveyors,
  • HS Code 8429: Self-Propelled Bulldozers, Angledozers, Graders, Levellers, Scrapers, Mechanical Shovels, Excavators
  • HS Code 8430: Other Moving, Grading, Levelling, Scraping, Excavating, Tamping, Compacting, Extracting Or Boring Ma
  • HS Code 8431: Parts Suitable For Use Solely Or Principally With The Machinery Of Headings N? 8425 To 8430
  • HS Code 8432: Agricultural, Horticultural Or Forestry Machinery For Soil Preparation Or Cultivation ; Lawn Or Spor
  • HS Code 8433: Harvesting Or Threshing Machinery, Including Straw Or Fodder Balers; Grass Or Hay Mowers; Machines F
  • HS Code 8434: Milking Machines And Dairy Machinery
  • HS Code 8435: Presses, Crushers And Similar Machinery Used In The Manufacture Of Wine, Cider, Fruit Juices Or Simi
  • HS Code 8436: Other Agricultural, Horticultural, Forestry, Poultry-Keeping Or Bee-Keeping Machinery, Including Ger
  • HS Code 8437: Machines For Cleaning, Sorting Or Grading Seed, Grain Or Dried Leguminous Vegetables; Machinery Used
  • HS Code 8438: Machinery, Not Specified Or Included Elsewhere In This Chapter, For The Industrial Preparation Or Ma
  • HS Code 8439: Machinery For Making Pulp Of Fibrous Cellulosic Material Or For Making Or Finishing Paper Orpaperboa
  • HS Code 8440: Book-Binding Machinery, Including Book-Sewing Machines
  • HS Code 8441: Other Machinery For Making Up Paper Pul, Paper Or Paperboard, Including Cutting Machines Of All Kind
  • HS Code 8442: Machinery, Apparatus And Equipment ( Other Than The Machine-Tools Of Heading N? 8456 To 8465), For T
  • HS Code 8443: Printing Machinery; Machines For Uses Ancillary To Printing
  • HS Code 8444: Machines For Extruding, Drawing, Texturing Or Cutting Man-Made Textile Materials.
  • HS Code 8445: Machines For Preparing Textile Fibres; Spinning, Doubling Or Twisting Machines And Other Machinery F
  • HS Code 8446: Telares.
  • HS Code 8447: Knitting Machines, Stitch-Bonding Machines And Machines For Making Gimped Yarn, Tulle, Lace, Embroid
  • HS Code 8448: Auxiliary Machinery For Use With Machines Of Heading N? 8444,8445,8446,8447 ( For Example, Dobbies,
  • HS Code 8449: Machinery For The Manufacture Or Finishing Or Felt Or Nonwovens In The Piece Or In Shapes, Including
  • HS Code 8450: Household Or Laundry-Type Washing Machines, Including Machines Which Both Wash And Dry
  • HS Code 8451: Machinery ( Other Than Machines Of Heading N?8450 ) For Washing, Cleaning,Wringing, Drying, Ironing,
  • HS Code 8452: Sewing Machines, Other Than Book-Sewing Machines Of Heading N? 8440; Furniture, Bases And Covers Spe
  • HS Code 8453: Machinery For Preparing, Tanning Or Working Hides, Skins Or Leather Or For Making Or Repairing Footw
  • HS Code 8454: Converters,Ladles,Ingot Moulds And Casting Machines, Of A Kind Used In Metallurgy Or In Metal Foundr
  • HS Code 8455: Metal-Rolling Mills And Rolls Thereof
  • HS Code 8456: Machine-Tools For Working Any Material By Removal Of Material, By Laser Or Other Light Or Photon Bea
  • HS Code 8457: Machining Centres, Unit Construction Machines (Single Station) And Multistation Transfer Machines, F
  • HS Code 8458: Tornos Que Trabajen Por Arranque De Metal
  • HS Code 8459: Machine-Tools ( Including Way-Type Unit Head Machines ) For Drilling, Boring, Milling, Threading Or
  • HS Code 8460: Machine-Tools For Deburring, Sharpening, Grinding, Honing, Lapping, Polishing Or Otherwise Finishing
  • HS Code 8461: Machine-Tools For Planing-Shaping, Slotting, Broaching, Gear Cutting, Gear Grinding Or Gear Finishin
  • HS Code 8462: Machine-Tools ( Including Presses) For Working Metal By Forging, Hammering Or Die-Stamping; Machine-
  • HS Code 8463: Other Machine-Tools For Workins Metal, Sintered Metal Carbides Or Cermets, Without Removing Metarial
  • HS Code 8464: Machine-Tools For Working Stone, Ceramics, Concrete, Asbestos-Cement Or Like Mineral Materials Or Fo
  • HS Code 8465: Machine-Tools (Including Machines For Nailing, Stapling, Glueing Or Otherwise Assembling) For Workin
  • HS Code 8466: Parts And Accessories Suitable For Use Solely Or Principally With The Machines Of Heading N? 8456 To
  • HS Code 8467: Tools For Working In The Hand, Pneumatic Or With Self-Contained Non-Electric Motor
  • HS Code 8468: Machinery And Apparatus For Soldering, Brazing Or Welding, Whether Or Not Capable Of Cutting, Other
  • HS Code 8469: Typewriters And Word-Processing Machines
  • HS Code 8470: Calculating Machines, Accounting Machines, Cash Registers, Postagefranking Machines, Ticket-Issuing
  • HS Code 8471: Automatic Data Processing Machines And Units Thereof; Magnetic Or Optical Readers, Machines For Tran
  • HS Code 8472: Other Office Machines ( For Example, Hectograph Or Stencil Duplicating Machines, Addressing Machines
  • HS Code 8473: Parts And Accessories (Other Than Covers, Carrying Cases And The Like) Suitable For Use Solely Or Pr
  • HS Code 8474: Machinery For Sorting, Screening, Separating, Washing, Crushing, Grinding, Mixing Or Kneading Earth,
  • HS Code 8475: Machine For Assembling Electric Or Electronic Lamps, Tubes Or Valves Or Flash-Bulbs, In Glass Envelo
  • HS Code 8476: Automatoc Goods-Vending Machines (For Example, Postage Stamp, Cigarette, Food Or Beverage Machines),
  • HS Code 8477: Machinery For Working Rubber Or Plastics Or For The Manufacture Of Products From These Materials, No
  • HS Code 8478: Machinery For Preparing Or Making Up Tobacco , Not Specified Or Included Elsewhere In This Chapter
  • HS Code 8479: Machines And Mechanical Appliances Having Individual Functions, Not Specified Or Included Elsewhere
  • HS Code 8480: Moulding Boxes For Metal Fondry; Mould Bases; Moulding Patterns; Moulds, Metal Carbides, Glass, Mine
  • HS Code 8481: Taps, Cocks, Valves And Similar Appliances For Pipes,Boiler Shells, Tanks, Vats Or The Like, Includi
  • HS Code 8482: Ball Or Roller Bearings
  • HS Code 8483: Transmission Sahfts (Including Cam Shafts And Crank Shafts) And Cranks; Bearing Housings And Plain
  • HS Code 8484: Gaskets And Similar Joints Of Metal Sheeting Combined With Other Material Or Of Two Or More Layers O
  • HS Code 8485: Machinery Parts, Not Containing Electrical Connectors, Insulators, Coils, Contacts Or Other Electric


The equivalent CPC Code (Rev. 1.1) is
xxxx: No Code defined

The equivalent ISIC Code (Rev. 3.1) is
xxxx: No Code defined
  Pas de Code

The equivalent NAICS Code (Rev. 2002) is
xxxx: No Code Defined

Translation of the Code description
84: Nuclear reactors, boilers, machinery and mechanical appliances; parts thereof
(2019-08-02)

Alternative Spellings (synonyms): reactor, Reactors, boiler, machineries
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